Apple raises Broadcom spending under new six-year plan to expand US chip and wireless component output

Apple said it will increase its spending with Broadcom under a new six-year agreement aimed at expanding U.S. chip production and scaling advanced wireless technology used across a range of Apple products. The company expects the deal, which it described as its largest commitment to date under its American Manufacturing Program (AMP), to exceed $30 billion.

Apple said the agreement will involve both the design and production of custom silicon components and wireless connectivity technologies for Apple products. The company said the new arrangement is expected to result in production of more than 15 billion U.S.-made chips, alongside what it called hundreds of American jobs, as part of broader efforts to build an end-to-end silicon supply chain in the United States.

A central part of the announcement is an expansion at Broadcom’s facility in Fort Collins, Colorado. Apple said Broadcom will expand and modernize manufacturing there with a $1.5 billion capital expenditure, and that the work is tied to the production of advanced radio frequency components, including FBAR filters, as well as advanced wireless connectivity technologies.

In Apple’s announcement, Tim Cook, the company’s chief executive officer, linked the Fort Collins components to device performance and connectivity. Cook said the “cutting-edge components built in Fort Collins” are essential for delivering the performance and wireless connectivity customers expect, and he credited the project as a deeper investment in U.S.-based suppliers that support Apple’s innovation and manufacturing commitments.

Broadcom’s chief executive, Hock Tan, said the company would expand its manufacturing footprint in Fort Collins and emphasized that the technology produced there supports connections globally. The executive framed the agreement as a continuation of a long-running relationship between the companies while positioning the expanded facility as part of an American innovation effort.

Apple said the Broadcom investment is part of its American Manufacturing Program, which it launched last year to accelerate manufacturing inside the United States. In this case, Apple described the Broadcom agreement as its largest AMP commitment to date, suggesting it views the Fort Collins expansion as both a scale-up of production capacity and a step toward more vertically integrated supply.

The announcement also sits within Apple’s stated plan to invest $600 billion in the U.S. economy over four years. Apple did not detail whether any portion of the Broadcom commitment is already under contract execution, but it characterized the latest agreement as advancing those broader investment and job-creation goals.

While the company provided key headline numbers, it did not specify the exact product categories that will use the new custom silicon and wireless components, nor did it disclose an expected timeline for when expanded Fort Collins output would fully ramp. It also did not break out how much of the estimated chip production is tied specifically to the AMP facility expansion versus other U.S. manufacturing operations across the supply chain.

For Apple and Broadcom, the next question is how quickly the expanded manufacturing and modernization work can translate into dependable supply for Apple’s hardware roadmap. Investors and industry watchers are likely to focus on whether similar AMP-scale partnerships follow, and whether the expanded focus on advanced radio frequency components and wireless connectivity technologies reduces bottlenecks for Apple’s devices as demand and product cycles shift.