Intel and Fortinet expand chip partnership to build next-generation security processor

Intel and Fortinet announced a strategic collaboration aimed at accelerating development of Fortinet Security Processor 6, or SP6, a purpose-built security chip intended to support more demanding security services and performance needs. The companies framed the effort as both an engineering push and a supply-chain move, saying the expanded relationship is designed to improve resilience and diversity across Fortinet’s global manufacturing footprint.

The announcement, made July 21, 2026, builds on what Intel described as a long-standing relationship with Fortinet. Intel said the collaboration brings together Fortinet’s “purpose-built security processor” expertise with Intel’s capabilities in advanced design, packaging, and manufacturing, with the goal of speeding SP6 development while increasing supply-chain assurance for customers worldwide.

In remarks included in the release, Intel CEO Lip-Bu Tan said that as threats evolve, security infrastructure must deliver both performance and innovation at scale. He added that Intel’s semiconductor leadership, along with advanced design, packaging, and manufacturing capabilities, can help security leaders like Fortinet move faster on critical security technologies while building a more resilient and diversified global supply chain.

Fortinet CEO Ken Xie, founder and chairman, said that Fortinet’s purpose-built ASICs have been a key differentiator for more than two decades, enabling security effectiveness as well as performance and efficiency. He said the expanded relationship with Intel will leverage Intel’s semiconductor technology and manufacturing expertise to help Fortinet accelerate and strengthen its ASIC strategy.

Beyond SP6 development itself, the companies said the work is intended to deliver a more integrated security processor capable of supporting increasingly sophisticated security services. Intel also pointed to planned collaboration across its ecosystem IP portfolio, as well as “disaggregated semiconductor design” and advanced packaging solutions tailored for both AI-enabled and cost-sensitive applications.

Intel said the partnership will explore additional opportunities to deepen collaboration across semiconductor technology, manufacturing, and infrastructure supporting future cybersecurity innovation. It described the work as expected to advance Fortinet’s long-term ASIC roadmap, support greater performance and service richness, and strengthen supply chain assurance for customers.

Sector context matters here because cybersecurity vendors have increasingly leaned on specialized hardware to deliver higher throughput and lower latency in network and security functions, especially as traffic grows and security services become more compute-intensive. Fortinet’s emphasis on purpose-built processors aligns with that broader trend, while Intel’s messaging highlights how chip packaging and manufacturing capabilities can influence time-to-market and supply resilience.

The release did not provide any specific technical specifications for SP6, such as target performance, process node details, production timing, or whether production volumes or multiple manufacturing sites are planned. It also did not disclose commercial terms, financial impact, or how near-term customer deployments will be affected.

For customers and partners, the practical question is how quickly SP6 can move from development into validated deployments, and whether Intel’s manufacturing and packaging involvement translates into faster iteration cycles and more reliable supply. The next indicates to watch will be any later disclosures from either company about SP6 milestones, customer adoption, and performance and validation results, along with broader progress on the companies’ stated long-term ASIC roadmap.