Intel names Seok-Hee Lee to lead Intel Foundry’s advanced packaging and system integration push

Intel on June 18 announced a leadership change at Intel Foundry, appointing Seok-Hee Lee as executive vice president of Intel Foundry with direct reporting to CEO Lip-Bu Tan. Lee will lead Intel’s advanced packaging, system integration, back-end technology development, and back-end manufacturing, a scope Intel says is meant to strengthen the company’s ability to deliver differentiated, system-level innovation for foundry customers.

The appointment also reflects Intel’s view that advanced packaging has become a critical enabler of next-generation computing. Intel said it is establishing advanced packaging as a more dedicated, focused business within Intel Foundry, citing the growing importance and complexity of packaging for performance, power efficiency, and heterogeneous integration across artificial intelligence and high-performance computing systems.

In remarks accompanying the announcement, Tan said advanced packaging and system integration are becoming “defining capabilities” for next-generation computing, and argued that Intel can better couple leading-edge logic, memory, networking, and other components to build high-performance systems for its customers. Tan also linked the leadership change to Intel’s goal of ramping advanced packaging technologies, explicitly referencing EMIB-T and HBI, “to high volume for customers and partners.”

Intel described Lee as bringing experience in leading complex, high-scale technology and manufacturing organizations, along with a track record of operational execution. The company said Lee joins Intel from SK On, where he served as president and CEO, and previously held the same roles at SK hynix. Intel characterized Lee as a semiconductor veteran with engineering leadership experience at Intel and in academia.

The structure of Intel Foundry’s leadership is also changing in parallel. Intel said that with the new focused and scalable operating model, Naga Chandrasekaran, executive vice president of Intel Foundry, will continue to report to CEO Lip-Bu Tan and lead front-end technology development and front-end manufacturing. Intel also said Chandrasekaran will continue overseeing design enablement and end-to-end customer-facing and business enablement functions that support Intel Foundry’s growth.

Intel did not provide additional quantitative targets, timelines, or financial details tied directly to the appointment. Instead, the company framed the move as part of a broader effort to rebuild execution and strengthen the technology and manufacturing engine behind Intel Foundry, emphasizing what it called speed, consistency, and predictability for customers and partners.

The company’s focus on advanced packaging aligns with how modern chip systems are increasingly assembled. Advanced packaging generally refers to techniques used after wafer fabrication to integrate different components, such as logic chips and memory, into a single system with tighter performance and power characteristics than earlier packaging approaches. By bundling packaging, system integration, and back-end manufacturing under one leader, Intel is effectively treating the “system assembly” phase as a core capability rather than a supporting function.

Intel’s mention of EMIB-T and HBI points to specific packaging-related technology areas. Intel described those as advanced packaging technologies it is preparing to ramp to high volume. While the announcement did not explain the underlying engineering differences between them, the company’s language suggests it expects packaging to become a recurring production discipline closely connected to customer demand for heterogeneous AI and compute systems.

Looking ahead, the key unanswered questions are how quickly Intel can convert packaging ramp plans into measurable outcomes such as yields, customer design wins, and shipment volumes, and how the new reporting structure affects coordination between front-end technology and back-end execution. Intel also did not detail what changes, if any, will occur in staffing, product roadmaps, or customer engagement processes for packaging and integration beyond the leadership responsibilities it outlined.

For now, the appointment functions as a announcement of where Intel wants to place operational emphasis within Intel Foundry. Investors and customers will likely watch for subsequent updates tying Lee’s organization to Intel’s packaging ramp progress and to the company’s broader efforts to strengthen manufacturing predictability and system-level delivery, especially as Intel moves toward scaling advanced technology nodes referenced in the announcement, including Intel 18A and Intel 14A, and future technologies.